ACCRETECH W-GM-4200

النموذج
W-GM-4200
العلامة التجارية
مراقبة
  • المواصفات
    مراقبة
    CNC
  • نظرة عامة على المنتج

    Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
    The non-contact measuring method achieves the stable alignment.
    Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
    The modular concept to make the optimum process line possible.
    Low damage grinding method is available,Mirror Finish.
    Machine specification ready for 2" to 6" wafer or for 4" to 8" wafer.
    Capable of various material processes, such as chemical compound semiconductor.


    نموذج كتيب (300 KB )

  • عن الشركة
    Accretech - Tokyo Seimitsu Co., Ltd

    Tokyo Seimitsu is, with us along with the wide range of people to both the "aspirations", to fuse technology with is each other, wisdom, information, let us create the world's No.1 products, and I decided. As a sign of this commitment, we introduced a ACCRETECH as a new corporate brand. This is a coined word that coalesce pronounced Accretech, "Accrete" and "Technology". The former refers to the "coexistence", it means the latter is the "technology". Companies, the State, beyond the boundaries of the region, to bring together the world's best technology to challenge the various challenges, and grow. This is what, is a new business form of increasing development in the 21st century, and we are confident.


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