The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.
AW-105R Applications:
GaAs, InP, GaN, SiC wafer Strip (Mainly)
GaAs, InP, GaN, SiC wafer Descum (Mainly)
Thin Film Head Resist Cleaning
Opto-Electronic Devices Cleaning
MEMS
Photoresist Stripping
 High dose implant (As+, B+, P+)
 Rework
 Post-polysilicon
 Post-metal
 Post-oxide
Controlled Resist Removal
 Post-develop descum
 Uniformity capability (<5% 1σ)
AW-105R Key Features:
Production-proven plasma Asher/Descum system.
Integrated solid robotic wafer handling, Single wafer process.
Up to 3%-5% Uniformity. Best for III-V Materials.
Frontside and backside isotropic removal.
Consistent wafer-to-wafer process cycle repeatability.
Element heating for up to 250oC.
50mm-150mm wafer capability. Up to 6.25” substrate.
Up to 4 wafer size capability without hardware change.
Fixed cassette station and wafer aligner/cooling station.
Can handle 50um thickness wafer.
PC controller with Advanced Allwin21 Software.
Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional).
Up to 3 gas lines with MFC.
Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option).
Pressure control with Throttle Valve.
15-inch Touch screen monitor GUI.
EMO, Interlocks, and Watchdog function.
GEM/SECS II (optional).
Small Footprint: 27”W x 40”D x 59”H (280LBs)
Made in U.S.A.
AW-105R Software Key Features:
Real time graphics display, process data acquisition, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”.
DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SECS II function (Optional).
Advanced Allwin21 End of Process (EOP) function (Optional)
.
AW-105R Specifications:
Wafer Size: Up to 6.25 inch.
Temperature: 60-250ºC (±2ºC)
Gas Lines: Up to three gas lines with MFCs.
Typical MFC configuration: 5 SLM O2 and 500 SCCM N2.
Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum
Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum
Particulate: <0.05 /cm2 (0.03um or greater)
Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no shift >5%
Selectivity: >1000:1
MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
95% uptime
*Contact Allwin21 sales for other applications and specifications
AW-105R Configuration:
Main Frame with Circuit Breakers, Solenoid Valves
Pentium Class PC with AW Software
Keyboard, Mouse, USB SW backup, and Cables
Chuck /w Heat, Pump Ring ,Lift Pins
① 2-4 inch; ② 2-6 inch; ③ 4-6 inch; ④ 6.125 inch; ⑤ 6.25 inch
Center Aligner and Cassette Station
① Two Dimensions ② Four Dimensions
Anodized Reactor with Door
Chamber Base plate with water sensor
Base Plate and Reactor Ceramic Ring
Base Plate and Chuck Ceramic Ring
Upper and Lower Electrodes
Quartz showerhead & Diffusion Disk
Main Control and Distribution PCBs
3-axis Integrated Robust Solid Robot
RF Matching Network with PCBs
13.56MHz RF Generator
① 300W ② 600W
MFC /w In-line Filter and Solenoid Isolation Valve
① One MFC; ② Two MFCs; ③ Three MFCs
AC/DC Box with Temperature Controller
MKS Baratron with Isolation Valve
Lamp Tower Alarm w/ Buzzer
Throttle Valve
Main Vacuum Valve
Front EMO, Interlocks
15-inch Touch Screen GUI
AW-105R Options:
End-of-Process (EOP)
GEM/SECS II (Software)
Vacuum Pump
Chiller for Chamber Base Plate

sales@allwin21.com