The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.
Engis provides full system solutions for flat lapping and precision bore finishing applications. We supply not only the capital equipment and machine accessories but a full range of tools and consumables. In addition to our Single Pass Bore Finishing Process, we now also offer multi-stroke honing systems. Our process develop labs can assist you with your flat lapping and precision honing requirements at no charge.