جديدة بناء لأمر تشريح، التكعيب وWafering المطاحن (31)
نماذج جديدة (31)
عرض all 31 نموذج
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ACCRETECH AD2000T/S

World's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000 mm/sec) and Y-axis (Up to 300 mm/sec) processing speed. Low Cost of ownership. Introducing refined Graphic User Interfac...

الجدول-W:7.874 in
الجدول-L:7.874 in
1 صور
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ACCRETECH AD20T/S

Foot print The world’s smallest footprint Footprint reduced 40% compared with Accretech’s existing machines High Throughput Twin-spindle design Substantially higher through-put resulting in l...

الجدول-W:9.843 in
الجدول-L:9.843 in
1 صور
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ACCRETECH AD3000T

Optimized spacing by utilizing all components and optional unit well within the compartment Standard Spindles up to 60,000 rpm (80,000 rpm as optional) Enhanced throughput ①X axis 1,000 mm/sec,...

الجدول-W:12.01 in
الجدول-L:12.01 in
1 صور
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ACCRETECH C-RW-200/300

Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette. Compatible with variety of materials. Realize a low running cost.

1 صور
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ACCRETECH CHAMP

Reasonable initial cost Small footprint High-performance CMP → Know-how from mass production Flexible Customization up to user’s requirement → From R&D, trial production to mass production 2”~1...

1 صور
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ACCRETECH CHAMP 300

Fusing the acquired technology of precision measuring instrument and semiconductor manufacturing equipment, Accretech fully meets the process performance required in advanced devices, and proposes ...

1 صور
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ACCRETECH FP3000

It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is the multi-functional prober which performs ...

1 صور
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ACCRETECH HRG200X

Less-damage Grinding with Shorter Process Time.Low Cost.High Accuracy.Mirror Finish Surface Grinding.

1 صور
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ACCRETECH HRG300

The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center position of the slide guides placed in a triang...

2 صور
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ACCRETECH HRG300A

The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center position of the slide guides placed in a triang...

1 صور
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ACCRETECH ML300EXWH

12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.

الجدول-W:12.0 in
الجدول-L:12.0 in
1 صور
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ACCRETECH PS300

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordi...

الجدول-W:3.937 in
الجدول-L:11.81 in
1 صور
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ACCRETECH SS10

Fastest and smallest 6-inch dicing machine Realized the high throughput and the reduced footprint at the same time. Auto alignment The image-processing engine accommodates variety of work. High...

الجدول-W:5.984 in
الجدول-L:5.984 in
1 صور
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ACCRETECH SS20

Footprint Small footprint with highly stable structure Compliant with large wafers 250 mm square work size as a standard feature * High-resolution microscope Improved resolution User Friendly...

الجدول-W:9.843 in
الجدول-L:9.843 in
1 صور
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ACCRETECH SS30

Footprint Small footprint with highly stable structure Compliant with varieties of work ・300 mm wafer ・Alignment with multiple works attachment ・Deformed and elastic work alignment High-resol...

الجدول-W:9.843 in
الجدول-L:11.81 in
1 صور
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ACCRETECH UF3000EX

High throughput is realized by synergetic effect of XY stage with high-speed and great quietness created by the high-speed wafer handling and exclusive driving unit. Furthermore, Z axis achieved th...

1 صور
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ACCRETECH UF3000EX-e

High throughput is realized by synergetic effect of XY stage with high-speed and great quietness created by the high-speed wafer handling and exclusive driving unit. Furthermore, Z axis achieved th...

1 صور
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ACCRETECH UF3000LX

High-speed and low-vibration are realized by adopting the newly developed exclusive XY driving system. Compared with the existing products, it achieved the small footprint by design change and red...

1 صور
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ACCRETECH W-GM-4200

Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-...

1 صور
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ACCRETECH W-GM-5200

1 صور
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ACCRETECH W-GM-6200

Wafer Size Φ 450 mm Best Seller Machine W-GM-Series Improve the Space Efficiency by the Compact Design Highly Accurate Grinding by the Synchronized X, Y, θ Support Control Easy Operation by Tou...

1 صور
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ENGIS EHG180

The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed ...

1 صور
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ENGIS EHG250

The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed ...

1 صور
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KOYO DXSG320

Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.

1 صور

SPEEDFAM SH-24-H

الجدول-W:25.827 in
الجدول-L:25.827 in