جديدة بناء لأمر تشريح، التكعيب وWafering المطاحن (2)
نماذج جديدة (2)
ACCRETECH PS300
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordin...
الجدول-W:3.937 in
الجدول-L:11.81 in
ACCRETECH SS30
Footprint Small footprint with highly stable structure Compliant with varieties of work ・300 mm wafer ・Alignment with multiple works attachment ・Deformed and elastic work alignment High-resolution ...
الجدول-W:9.843 in
الجدول-L:11.81 in