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ACCRETECH ML300EXWH
12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.
Table-W:12.0 in
Table-L:12.0 in
New Slicing, Dicing & Wafering Grinders
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- Country of Origin: Japan1Country of OriginBack
Country of Origin
- Japan
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- CNC (1)
- Table-L: 12 in