The AccuThermo AW410 was derived from the AG Associates 610 production-proven design. Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system. The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1 600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.
AccuThermo AW 410 Applications:
Silicides formation and annealing
Nitridation of metals
Other heat treatment process
AccuThermo AW 410 Typical Application Areas:
Compound industry: GaAs,GaN,GaP,GaINP,InP,SiC, III-V,II-VI
Optronics, Planar optical waveguides, Lasers
AccuThermo AW 410 Key Features:
35 years’ production-proven real RTP/RTA/RTO/RTN system.
Scattered IR light by special gold plated Al chamber surface.
Allwin21 advanced Software package with real time control technologies and many useful functions.
Consistent wafer-to-wafer process cycle repeatability.
Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime.
Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates
Elimination of external contamination by Isolated Quartz Tube
Up to six gas lines with MFCs and shut-off valves
Made in U.S.A.
AccuThermo AW 410 Software Key Features:
Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Closed-loop temperature control with temperature sensing.
Precise time-temperature profiles tailored to suit specific process requirements.
Faster, easier Programmable comprehensive calibration of all subsystems, leading to enhanced process results.
A recipe editor to create and edit recipes to fully automate the processing of wafers inside the AccuThermo RTP
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions.
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting feature which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
Use PowerSum technology to detect the process and increase Yield.
Watchdog function: If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SECS II function (Optional).
AccuThermo AW 410 Specifications:
Wafer sizes: Small pieces, 2", 3", 4" wafer capability
Recommended ramp up rate: Programmable, 10°C to 120°C per second. Maximum Rate: 200°C (NOT RECOMMENDED)
Recommended steady state duration: 0-300 seconds per step.
Ramp down rate: Non-programmable, 10°C to 200°C per second.
Recommended steady state temperature range: 150°C - 1150°C. Maximum 1250°C (NOT RECOMMENDED)
ERP Pyrometer 450-1250°C with ±1°C accuracy when calibrated against an instrumented thermocouple wafer.
Thermocouple 100-800±0.5°C with ±0.5°C accuracy & rapid response.
Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer. (Repetition specifications are based on a 100-wafer set.)
Temperature uniformity: ±5°C across a 6" (150 mm) wafer at 1150°C. (This is a one sigma deviation 100 angstrom oxide.) For a titanium silicide process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700°C.
Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30 PSIG and pre-filtered to 1 micron. Typically, N2, O2, Ar, He, Forming gas, NH3, N2O2 are used.
AccuThermo AW 410 Configuration:
AccuThermo AW 410 Main Frame with wires.
Power Type: Three Phase, worldwide power type(50/60 Hz)
CE Mark if Necessary
Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary software package.
Mouse and standard keyboard .
Aluminum oven chamber with water cooling passages and gold plating plates..
Door plate with one TC connection port.
Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window.
Oven control board and one main control board.
Bottom and top heating with 17 (1.5KW ea) Radiation heating lamp module with 4 bank zones (Top Front&Rear, Bottom Front&Rear).
Quartz Tray for 2 to 4 inch round wafer or customized.
Gas line with one Gas MFC without shut-off valve
T-Shaped Quartz with qualified K Type TC and one set holder for 100-800°C temperature measurement.
Package of 5 pieces of thermocouple wires as spare TC
USB with original Software backup.
AccuThermo AW 410 Options:
Multiple Process Gases (Up to 6) and MFCs with Extended Gas Box and Gas Control Board
Carrier or Susceptor for small sample, transparent substrate and substrate with metal thin film on top.
Patented ERP Pyrometer (400-1250°C) as non-contact high temperature sensor.
Chiller for ERP Pyrometer
2-inch, 4-inch TC Wafer, Single Point for Pyrometer calibration
Omega Meter for Pyrometer and Thermocouple calibration
Shut-off valve for Quartz Tube&Lamps cooling control
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines.
We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment have been used in production and R&D since the 1990′s. They have proven processes and research. Allwin21 Corp. customizes these systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Rapid Thermal Process
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Perkin Elmer 4410
Perkin Elmer 4450
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Upgrade Kits for :
AG Associates Heatpulse 210, Minipulse 310, Heatpulse 410, Heatpulse 610 Rapid Thermal Processing equipment; Tegal 901e, Tegal 903e, Gasonics AE 2001, Matrix 303, Matrix 403, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam AutoEtch 480, Lam AutoEtch 580, Lam AutoEtch 680, Lam AutoEtch 780 Plasma Etcher equipment;Matrix 105, Matrix 106,Matrix 205, Matrix 101,Matrix 102,Matrix 103, Matrix 104, Matrix 10, Gasonics Aura 1000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000 Plasma Asher ,Plasma Descum Equipment; Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480, Perkin-Elmer 2400 sputter deposition systems
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