The AW-2001R single-wafer Etcher is an automated tool designed as a flexible downstream Microwave system for high-volume wafer fabrication. AW-2001R is in direct response to manufacturer’s concerns for wafer damage, uniformity, uptime, reliability and production-proven technology
Contact Slope Etch
Thermal Oxide Etch
LPCVD Nitride Etch
PECVD Nitride Etch
RIE Damage Removal
Backside Etch (Poly, Nitride, or Oxide)
Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å)
Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly
AW-2001R Key Features:
Production-proven plasma etching system.
No damage downstream plasma etcher(≤0.1 Volt CV-shift )
“Extended” Alumina Plasma Tube for better uniformity.
Frontside isotropic etch and backside etch if pins-up
75mm-150mm wafer capability.
Varied wafer sizes capability without hardware change if necessary.
Integrated 3-axis robotic wafer handling for increased throughput and less wafer breakage.
Optional alignment/cooling station to prevent wafer breakage
Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator for better process repeatability.
Can handle 50um thickness wafer
PC controller with Advanced Allwin21 Software Package with touch screen monitor GUI
Can handle 50um thickness wafer
4 isolated gas lines with MFC’s
Pressure control for process repeatability
EMO, Interlocks and Watchdog function
GEM/SECS II interface, Optional
Light Tower, Optional
Made in U.S.A.
AW-2001R Software Key Features:
Real time graphics display (GUI), process data acquisition, display, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SEC II function (Optional)
Wafer Size: 2, 3, 4, 5, 6 inch Capability.
Chuck Temperature: 60-110ºC (±2 ºC)
Gases: NF3 CF4 HE O2
100mm : ± 3% (5% 3 sigma) *
150mm : ± 5% (8% 3 sigma) *
*max.- min. /2 x average
Reproducibility (w-t-w): 10% 3 sigma
Particulate: 0.05p/cm2 > 0.3µm
NO DAMAGE: ≤0.1 Volt CV-shift
* Contact Allwin21 sales for other applications and specifications
Main Frame with Breakers, Relays and Wires
Pentium Class PC with AW Software
Keyboard, Mouse, USS with SW backup and Cables
Fixed Cassette Stations:1 Two Cassette Stations, or One Cassette Station / One Centering/Alignment Station
Metal Shower head
"Extended' Alumina Plasma Tube for better Uniformity.
Orifice, Gas Cap
Chamber Body and Top Plate
Main Control , Distributor PCB and DC
H1 -7X10.5 Integrated 3-Axls Solid Robot
Water-Cooled Magnetron and Waveguide
Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator
4 Isolated Gas Lines with Pneumatic Valves and MFC
Main & Slow Vacuum Valves
Front EMO, Interlocks
15-rnch Touch Screen GUI
GEM/SECS II function (Software)
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