The AW-2001R single-wafer Etcher is an automated tool designed as a flexible downstream Microwave system for high-volume wafer fabrication. AW-2001R is in direct response to manufacturer’s concerns for wafer damage, uniformity, uptime, reliability and production-proven technology
Contact Slope Etch
Thermal Oxide Etch
LPCVD Nitride Etch
PECVD Nitride Etch
RIE Damage Removal
Backside Etch (Poly, Nitride, or Oxide)
Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å)
Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly
AW-2001R Key Features:
Production-proven plasma etching system.
No damage downstream plasma etcher(≤0.1 Volt CV-shift )
“Extended” Alumina Plasma Tube for better uniformity.
Frontside isotropic etch and backside etch if pins-up
75mm-150mm wafer capability.
Varied wafer sizes capability without hardware change if necessary.
Integrated 3-axis robotic wafer handling for increased throughput and less wafer breakage.
Optional alignment/cooling station to prevent wafer breakage
Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator for better process repeatability.
Can handle 50um thickness wafer
PC controller with Advanced Allwin21 Software Package with touch screen monitor GUI
Can handle 50um thickness wafer
4 isolated gas lines with MFC’s
Pressure control for process repeatability
EMO, Interlocks and Watchdog function
GEM/SECS II interface, Optional
Light Tower, Optional
Made in U.S.A.
AW-2001R Software Key Features:
Real time graphics display (GUI), process data acquisition, display, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SEC II function (Optional)
Wafer Size: 2, 3, 4, 5, 6 inch Capability.
Chuck Temperature: 60-110ºC (±2 ºC)
Gases: NF3 CF4 HE O2
100mm : ± 3% (5% 3 sigma) *
150mm : ± 5% (8% 3 sigma) *
*max.- min. /2 x average
Reproducibility (w-t-w): 10% 3 sigma
Particulate: 0.05p/cm2 > 0.3µm
NO DAMAGE: ≤0.1 Volt CV-shift
* Contact Allwin21 sales for other applications and specifications
Main Frame with Breakers, Relays and Wires
Pentium Class PC with AW Software
Keyboard, Mouse, USS with SW backup and Cables
Fixed Cassette Stations:1 Two Cassette Stations, or One Cassette Station / One Centering/Alignment Station
Metal Shower head
"Extended' Alumina Plasma Tube for better Uniformity.
Orifice, Gas Cap
Chamber Body and Top Plate
Main Control , Distributor PCB and DC
H1 -7X10.5 Integrated 3-Axls Solid Robot
Water-Cooled Magnetron and Waveguide
Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz Microwave Power Generator
4 Isolated Gas Lines with Pneumatic Valves and MFC
Main & Slow Vacuum Valves
Front EMO, Interlocks
15-rnch Touch Screen GUI
GEM/SECS II function (Software)
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines.
We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment have been used in production and R&D since the 1990′s. They have proven processes and research. Allwin21 Corp. customizes these systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Rapid Thermal Process
Perkin Elmer 4400
Perkin Elmer 4410
Perkin Elmer 4450
Metal Film Metrology
Upgrade Kits for :
AG Associates Heatpulse 210, Minipulse 310, Heatpulse 410, Heatpulse 610 Rapid Thermal Processing equipment; Tegal 901e, Tegal 903e, Gasonics AE 2001, Matrix 303, Matrix 403, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam AutoEtch 480, Lam AutoEtch 580, Lam AutoEtch 680, Lam AutoEtch 780 Plasma Etcher equipment;Matrix 105, Matrix 106,Matrix 205, Matrix 101,Matrix 102,Matrix 103, Matrix 104, Matrix 10, Gasonics Aura 1000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000 Plasma Asher ,Plasma Descum Equipment; Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480, Perkin-Elmer 2400 sputter deposition systems
Contact Us by email@example.com