The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology
AW-901eR /AW903eR Applications:
Silicon Nitride Etch
Silicon Dioxide Etch
Polyimide ILD Etch
LDD Spacer Etch
Zero Layer Etch
Oxide/Contact/Via Etch (Down to 0.8um)
AW-901eR/ AW903eR Key Features:
Production-proven plasma etching system.
Up to 3%-5% Uniformity.
Frontside and backside isotropic and anisotropic etch.
Process Temperature: 6-65°C .
75mm-150mm wafer capability.
Integrated solid robotic wafer handling. Single wafer process.
Fixed cassette station and wafer aligner/cooling station.
Can handle 50um thickness wafer.
PC controller with Advanced Allwin21 Software.
Endpoint detection with Allwin21 SLOPE technology. (Optional)
Up to 4 gas lines with MFC’s.
MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W.
Pressure control with UPC. Throttle valve is optional.
Touch screen GUI.
EMO, Interlocks, and Watchdog function.
GEM/SECS II (Optional)
Made in U.S.A.
AW-901eR/ AW-903eR Software Key Features:
Real time graphics display, process data acquisition, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”.
DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SECS II function (Optional).
Advanced Allwin21 Endpoint Detection function (Optional).
AW-901eR/ AW903eR Specifications:
Up to 6 inch Capability
Throughput: 30-60 WPH, Process Dependent
Temperature: 6-65ºC (±2 ºC) capability
Gas Lines: 4 gas lines with MFCs.
Etcher Rate: AW-901eR: 0-8000A/minute; AW-903eR: 0-4000A/minute, Process Dependent
Uniformity: Up to ±3%, Process Dependent
Particulate: <0.05 /cm2 (0.03um or greater)
Selectivity: 901eR: 2-20:1 ; AW-903eR: 2-20:1, Process Dependent
MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
* Contact Allwin21 sales for other applications and specifications
AW-901eR/ AW-903eR Configuration:
Main Frame, Standard
Pentium Class PC with AW Software
Keyboard, Mouse, USB with SW backup, and Cables
① 3”; ② 4”; ③ 5”; ④ 6”
Wafer Aligner/Cooling Station
3-Axis Integrated Solid Robot
① H-Zero (Standard); ② H1-7X10.5 (TTW)
Fixed Cassette Station
① 901eR Non-anodized; ② 903eR Anodized /W Flat
③ 903eR Anodized /wo Flat ④ 903eR Non-anodized /W Flat
① 901eR Non-anodized; ② 903eR Anodized
③ 903eR Non-anodized; ④ 903eR High Performance
⑤ Direct Cooling; ⑥ Non-Direct Cooling
① Quartz; ② Ceramic; ③ SST
① Aluminum; ② Quartz; ③ Ceramic
Main Control Board
Gas Box /w 4 inline Gas Lines, MFC, filters, and Pneumatic valves
RF Matching Network with PCB
13.56 MHz RF Generator (Air or Water Cooled)
① MKS Elite:300HD; ② MKS Elite:600HD
③ MKS Elite:1000HD; ④ ENI ACG 3; ⑤ ENI ACG 10
UPC Pressure Control
① 225 SCCM,901eR; ② 2000 SCCM, 903eR
MKS Baratron with Pneumatic Isolation Valve
Main Vacuum Valves
Front EMO, Interlocks
15-inch Touch Screen GUI
AW-901eR/ AW-903eR Options:
EOP Module with PCB
GEM/SECS II function (Software)
Lamp tower alarm with buzzer
Throttle Valve Pressure Control
Chiller for chuck and chamber
Through The Wall
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines.
We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment have been used in production and R&D since the 1990′s. They have proven processes and research. Allwin21 Corp. customizes these systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Rapid Thermal Process
Perkin Elmer 4400
Perkin Elmer 4410
Perkin Elmer 4450
Metal Film Metrology
Upgrade Kits for :
AG Associates Heatpulse 210, Minipulse 310, Heatpulse 410, Heatpulse 610 Rapid Thermal Processing equipment; Tegal 901e, Tegal 903e, Gasonics AE 2001, Matrix 303, Matrix 403, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam AutoEtch 480, Lam AutoEtch 580, Lam AutoEtch 680, Lam AutoEtch 780 Plasma Etcher equipment;Matrix 105, Matrix 106,Matrix 205, Matrix 101,Matrix 102,Matrix 103, Matrix 104, Matrix 10, Gasonics Aura 1000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000 Plasma Asher ,Plasma Descum Equipment; Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480, Perkin-Elmer 2400 sputter deposition systems
Contact Us by email@example.com