The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership.
Low cost production-proven plasma Asher / Descum
Front and backside isotropic photoresist removal.
Barrel/Batch Manual Load Process
AW-B3000 Key Features:
Production-proven plasma Stripper/Asher/Descum technology.
Up to 25% Uniformity. Much lower if used with a Faraday Cage.
Consistent wafer-to-wafer uniformity.
TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.
End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness.
Samples, 6” square, and up to 8” round wafers capable.
Many wafer sizes capability without hardware change.
Can handle different thickness wafer with different carriers.
New controller with PC with Advanced AW Software
Up to 5 isolated gas lines with MFC’s
13.56 MHz RF Generator. (Air-cooled Optional)
Pressure Control Throttle Valve for better process repeatability. (Optional)
MKS Baratron (Optional)
Touch screen GUI
EMO, Interlocks and Watchdog function
GEM/SECS II (Optional)
Made in U.S.A.
AW-B3000 Software Key Features:
Real time graphics display (GUI), process data acquisition, display, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SEC II function (Optional).
Advanced Allwin21 EOP function (Optional)
Wafer Size: Sample to 200mm Capability. Multiple wafer size without hardware change
High Throughput: Up to 75 WPH. Process Dependent.
Temperature: Only TC Option can be used for N2 plasma to heat the substrates up to 170°C.
Gas Lines: Up to 5 isolated gas lines with MFCs.
Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR. Slower if Faraday Cage is used
Uniformity: Up to 25%. Much lower with Faraday Cage.
Particulate: <0.05 /cm2 (0.03um or greater)
Damage: Low damage with Faraday Cage.
MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
* Contact Allwin21 sales for other applications and specifications
Main Body with wires
Pentium Class PC with AW Software
Keyboard, Mouse, USB with SW backup and Cables
Main Control PCB and DC
Transformer, Circuit Breaker,Contactor
1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC
Purge has manual regulator in controller box to control speed.
Quartz Chamber: Dia 12” x Depth 23”;
RF Match Network Integrated in the Main Body of tool.
Chamber Door with quartz plate in the Main Body.
Gas and vacuum lines Connections in the Main Body
13.56MHz RF Generator (Air-Cooled is Optional)
① 300W; ② 600W; ③ 1000W; ④ 1200W
Lamp tower alarm with buzzer
Main Vacuum Valve
Front EMO, Interlocks
15-inch Touch Screen GUI
End-of-Process (EOP) function.
Throttle Valve for pressure control.
Air-cooled RF Generator.
GEM/SECS II function (Software)
Thermocouple for Chamber Temperature
The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology
AW-901eR /AW903eR Applications:
Silicon Nitride Etch
Silicon Dioxide Etch
Polyimide ILD Etch
LDD Spacer Etch
Zero Layer Etch
Oxide/Contact/Via Etch (Down to 0.8um)
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines.
We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment have been used in production and R&D since the 1990′s. They have proven processes and research. Allwin21 Corp. customizes these systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Rapid Thermal Process
Perkin Elmer 4400
Perkin Elmer 4410
Perkin Elmer 4450
Metal Film Metrology
Upgrade Kits for :
AG Associates Heatpulse 210, Minipulse 310, Heatpulse 410, Heatpulse 610 Rapid Thermal Processing equipment; Tegal 901e, Tegal 903e, Gasonics AE 2001, Matrix 303, Matrix 403, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam AutoEtch 480, Lam AutoEtch 580, Lam AutoEtch 680, Lam AutoEtch 780 Plasma Etcher equipment;Matrix 105, Matrix 106,Matrix 205, Matrix 101,Matrix 102,Matrix 103, Matrix 104, Matrix 10, Gasonics Aura 1000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000 Plasma Asher ,Plasma Descum Equipment; Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480, Perkin-Elmer 2400 sputter deposition systems
Contact Us by email@example.com