The Upgrade Kits include an advanced Allwin21 AW System Control with touch screen Graphic User Interface (GUI) and a new PC with Allwin21 real-time control Software. Most upgrade kits include new main control board, new wafer heating functions with Allwin21’s Advanced RTP technology, fixed cassette station instead of the original elevator, and robust 3-Axis integrated robotic wafer handling (instead of the original). The kits are easy to incorporate (plug-and-play) into the original systems. Onsite installation available for most of kits as well (so all facilities connections can stay in place). Each upgrade kit will enhance the entire systems’ operation and allow for far better Process Repeatability, Stability, and Uniformity
Allwin21 Upgrade Kits Software Key Features:
Real time graphics display, process data acquisition, and analysis.
Advanced Temperature Control for RTP and other “lamp-based” wafer heating systems.
Precise parameters profiles tailored to suit specific process requirements.
Consistent wafer-to-wafer process cycle repeatability.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
Closed-loop process parameters control.
GEM/SECS II function (Optional).
Advanced Allwin21 EOP function (Optional)
Why Allwin21 Upgrade Kits:
Low cost solution of obsolete components and parts.
Increase stability of the original system.
Add network function (GEM/SECS II) for Fab/Lab integration
PC control for data storage.
Friendly GUI operation.
More precise control.
Better performance (Repeatability, Uniformity, Stability)
Easier maintenance, calibration and troubleshooting.
Upgraded Equipment Models :
Gasonics Aura 1000
Gasonics AE 2001
Gasonics Aura 3010
Lam AutoEtch 490
Lam AutoEtch 590
Lam AutoEtch 690
Lam AutoEtch 790
Lam AutoEtch 480
Lam AutoEtch 580
Lam AutoEtch 680
Lam AutoEtch 780
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines.
We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment have been used in production and R&D since the 1990′s. They have proven processes and research. Allwin21 Corp. customizes these systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.
We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Rapid Thermal Process
Perkin Elmer 4400
Perkin Elmer 4410
Perkin Elmer 4450
Metal Film Metrology
Upgrade Kits for :
AG Associates Heatpulse 210, Minipulse 310, Heatpulse 410, Heatpulse 610 Rapid Thermal Processing equipment; Tegal 901e, Tegal 903e, Gasonics AE 2001, Matrix 303, Matrix 403, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam AutoEtch 480, Lam AutoEtch 580, Lam AutoEtch 680, Lam AutoEtch 780 Plasma Etcher equipment;Matrix 105, Matrix 106,Matrix 205, Matrix 101,Matrix 102,Matrix 103, Matrix 104, Matrix 10, Gasonics Aura 1000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000 Plasma Asher ,Plasma Descum Equipment; Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480, Perkin-Elmer 2400 sputter deposition systems
Contact Us by firstname.lastname@example.org