ENGIS EHG250
- SpecsDimensions57” (W) x 39” (D) x 63” (H)Weight2646 (LBS)
- Product Overview
The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.
- About Company
Engis provides full system solutions for flat lapping and precision bore finishing applications. We supply not only the capital equipment and machine accessories but a full range of tools and consumables. In addition to our Single Pass Bore Finishing Process, we now also offer multi-stroke honing systems. Our process develop labs can assist you with your flat lapping and precision honing requirements at no charge.
Distributors and Sales Offices
- Distributors8Sap Technical & Marketing Consultants
No. 33/33/5, " Annapoorna", Kanakapura Road, Jaraganahalli
J.P.Nagar Post,
Bangalore, Karnataka 560 078
India - Sales Offices6Engis (UK) Limited
9, Centenary Business Park
Station Road, Henley-On-Thames
Oxon RG9 1DS
United KingdomEngis Korea Co., Ltd.
258-11, Songsan-ri
Yanggam-myeon, Hwaseong-City
Gyeonggi-do 445-933
Korea, Republic ofEngis Asia Pacific Pte. Ltd.
8 Kaki Bukit Road 2
03-04 Ruby Warehouse Complex
Singapore 417841
Singapore