MK-BDT12D Semiconductor End-Pump Laser Marking Machine:
Model Features
Its outputting laser spots is small, lines marking is thin. The beam quality is high, laser output is stable, and it is easier to debug the marking. High frequent laser is more suitable for a number of non-metallic materials. It has the performance of marking faster. It has volume slightly; there is no need to possess external water cooling equipment. Overall Machine has stable performance; the volume is slight, the power consumption is low.

Application of materials and industrial applications
Compared with side-pump YAG marking machine, its pulse width is narrower, the width of sculpture line is uniform and fine, which is suitable for marking a variety of non-metallic materials. It is suitable for some occasions requiring more sophisticated and more accurate. It’s applicable to some electronic components, plastic buttons, integrated circuits (IC), electrical appliances, mobile communications and other industries.

Specifications
Maximum laser power: 12W
Laser wavelength: 1064nm
Beam quality M2: <2.5
Q-frequency: ≤ 100kHz
Minimum Q-laser pulse width: 25ns
The largest Q-peak laser power: 100KW
Standard engraving range: 110x110mm / 200x200mm
Minimum line width: 0.01mm
Repeatability: ± 0.001mm
Total Power: 2KW
The demand for electricity: 220V ± 22V/50Hz/10A