This equipment is dedicated to produce a semiconductor material by plating of copper or copper alloy strip with tin. (Possession of advanced and unique technology for tin plating)

Basic data

Material : Copper & CU Alloy strip
Strip thickness : 0.15 ~ 0.8 mm
Strip width : 200 ~ 350 mm
Coil weight : Max. 3,500 kg
Coil I.D : 400 mm
Coil O.D : Max. 1,350 mm
Furnace temperature : 300 ~ 650ºC

Line specification

Line speed : Max. 35 mpm
Thickness of plating : Cu : 0.5 μ ~ 1.5 μ (Avg 1.0 μ)
Sn : 0.8 μ ~ 2.0 μ (Avg 1.5 μ)