ACCRETECH AD2000T/S
World's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000 mm/sec) and Y-axis (Up to 300 mm/sec) processing speed. Low Cost of ownership. Introducing refined Graphic User Interface T...
ACCRETECH AD20T/S
Foot print The world’s smallest footprint Footprint reduced 40% compared with Accretech’s existing machines High Throughput Twin-spindle design Substantially higher through-put resulting in lower ...
ACCRETECH AD3000T
Optimized spacing by utilizing all components and optional unit well within the compartment Standard Spindles up to 60,000 rpm (80,000 rpm as optional) Enhanced throughput ①X axis 1,000 mm/sec, Y a...
ACCRETECH ML300EXWH
12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.
ACCRETECH SS10
Fastest and smallest 6-inch dicing machine Realized the high throughput and the reduced footprint at the same time. Auto alignment The image-processing engine accommodates variety of work. High per...
ACCRETECH SS20
Footprint Small footprint with highly stable structure Compliant with large wafers 250 mm square work size as a standard feature * High-resolution microscope Improved resolution User Friendly Impro...
ACCRETECH SS30
Footprint Small footprint with highly stable structure Compliant with varieties of work ・300 mm wafer ・Alignment with multiple works attachment ・Deformed and elastic work alignment High-resolution ...