26 모델 게시

UNIVERSAL LASER ILS-12.75

마킹 영역(X):24.0 in
마킹 영역(Y):48.0 in
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UNIVERSAL LASER ILS-9.75

마킹 영역(X):24.0 in
마킹 영역(Y):36.0 in
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UNIVERSAL LASER ILS12.150D

The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power ra...

마킹 영역(X):48.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
1 사진
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UNIVERSAL LASER ILS12.75

The ILS12.75 is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The single laser platform supports either one...

마킹 영역(X):48.0 in
마킹 영역(Y):24.0 in
와트:75.0 w
4 사진
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UNIVERSAL LASER ILS9.150D

The ILS9.150D is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The dual laser platform supports a power range o...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
1 사진
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UNIVERSAL LASER ILS9.75

he ILS9.75 is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The single laser platform supports either one 10.6µ...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:75.0 w
5 사진
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UNIVERSAL LASER M-300

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in

UNIVERSAL LASER PLS-4.75

마킹 영역(X):18.0 in
마킹 영역(Y):24.0 in
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UNIVERSAL LASER PLS-6.150D

The PLS6.150D is a free-standing platform with a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platfor...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
5 사진
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UNIVERSAL LASER PLS-6.75

The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports either one 10.6µm...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
5 사진
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UNIVERSAL LASER PLS4.75

The PLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports either one 10.6µ...

마킹 영역(X):24.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
4 사진
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UNIVERSAL LASER PLS6.150D

The PLS6.150D is a free-standing platform with a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platfor...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:150.0 w
1 사진
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UNIVERSAL LASER PLS6.75

The PLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports either one 10.6µm...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
1 사진
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UNIVERSAL LASER PLS6MW

The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO2 or fiber lasers. The PLS6MW ...

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
4 사진
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UNIVERSAL LASER ULTRA R5000

The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academ...

마킹 영역(X):32.0 in
마킹 영역(Y):24.0 in
와트:150.0 w
1 사진
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UNIVERSAL LASER ULTRA X6000

The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research ...

마킹 영역(X):36.0 in
마킹 영역(Y):24.0 in
와트:300.0 w
1 사진
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UNIVERSAL LASER VLS-2.30

마킹 영역(X):12.0 in
마킹 영역(Y):16.0 in
와트:30.0 w
1 사진
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UNIVERSAL LASER VLS-3.50

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in
와트:50.0 w
1 사진
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UNIVERSAL LASER VLS-3.60

마킹 영역(X):12.0 in
마킹 영역(Y):24.0 in
와트:60.0 w
1 사진
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UNIVERSAL LASER VLS-4.60

마킹 영역(X):18.0 in
마킹 영역(Y):24.0 in
와트:60.0 w
1 사진
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UNIVERSAL LASER VLS-6.60

마킹 영역(X):18.0 in
마킹 영역(Y):32.0 in
와트:60.0 w
1 사진
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UNIVERSAL LASER VLS2.30DT

The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped ...

마킹 영역(X):16.0 in
마킹 영역(Y):12.0 in
와트:30.0 w
1 사진
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UNIVERSAL LASER VLS3.60DT

The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equ...

마킹 영역(X):24.0 in
마킹 영역(Y):12.0 in
와트:60.0 w
1 사진
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UNIVERSAL LASER VLS3.75

The VLS3.75 is a free-standing platform with a materials processing envelope of 24" x 12" x 8.5" or 2,448 in³ (610 x 305 x 216 mm or 40,187 cm³). The single laser platform supports a 10.6µm CO2 las...

마킹 영역(X):24.0 in
마킹 영역(Y):12.0 in
와트:75.0 w
1 사진
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UNIVERSAL LASER VLS4.75

The VLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports a 10.6µm CO2 las...

마킹 영역(X):24.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
1 사진
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UNIVERSAL LASER VLS6.75

The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO2 lase...

마킹 영역(X):32.0 in
마킹 영역(Y):18.0 in
와트:75.0 w
1 사진
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