ACCRETECH ACCURA

Gantry_type Coordinate Measuring Machine with precision & high speed Maximum speed: 800mm/s (optional) CAA (Computer Aided Accuracy) adjustment enables high accuracy X-axis guide made by CARAT enab...

ACCRETECH AD2000T/S

World's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000 mm/sec) and Y-axis (Up to 300 mm/sec) processing speed. Low Cost of ownership. Introducing refined Graphic User Interface T...

ACCRETECH AD20T/S

Foot print The world’s smallest footprint Footprint reduced 40% compared with Accretech’s existing machines High Throughput Twin-spindle design Substantially higher through-put resulting in lower ...

ACCRETECH AD3000T

Optimized spacing by utilizing all components and optional unit well within the compartment Standard Spindles up to 60,000 rpm (80,000 rpm as optional) Enhanced throughput ①X axis 1,000 mm/sec, Y a...

ACCRETECH C-RW-200/300

Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette. Compatible with variety of materials. Realize a low running cost.

ACCRETECH CHAMP

Reasonable initial cost Small footprint High-performance CMP → Know-how from mass production Flexible Customization up to user’s requirement → From R&D, trial production to mass production 2”～12” p...

ACCRETECH CHAMP 300

Fusing the acquired technology of precision measuring instrument and semiconductor manufacturing equipment, Accretech fully meets the process performance required in advanced devices, and proposes ...

ACCRETECH CONTURA

Worldwide standard of Coordinate measuring machine with brand-new specifications & design X900/Z800 and X1200/Z1000 have lined-up in addition to original X700/Z600 and X1000/Z600.

ACCRETECH CONTURA AKTIV

Improved size variation X900/Z800 and X1200/Z1000 have lined-up in addition to original X700/Z600 and X1000/Z600.

ACCRETECH FP3000

It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is the multi-functional prober which performs t...

ACCRETECH HRG200X

Less-damage Grinding with Shorter Process Time.Low Cost.High Accuracy.Mirror Finish Surface Grinding.

ACCRETECH HRG300

The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center position of the slide guides placed in a triang...

ACCRETECH HRG300A

The structure with the little mechanical transformation against the workload of grinding is realized by placing the processing position on the center position of the slide guides placed in a triang...

ACCRETECH MICURA

Measurement range: MICURA can measure and evaluate high-precision small parts and is best suited for applications that require high-accuracy measurement, including medical devices such as prostheti...

ACCRETECH ML300EXWH

12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.

ACCRETECH PG3000RMX

The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Perform...

ACCRETECH PRISMO NAVIGATOR 10

Maintains fast and stable accuracy under environmental conditions that include such risks as temperature variations, vibration, and dirt. Flexibly handles all kinds of measurements. Requires no spe...

ACCRETECH PRISMO NAVIGATOR 7

High-speed CNC Coordinate measuring machine offering high accuracy in various environments.

ACCRETECH PRISMO ULTRA

PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge ...

ACCRETECH PS300

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordin...

ACCRETECH SS10

Fastest and smallest 6-inch dicing machine Realized the high throughput and the reduced footprint at the same time. Auto alignment The image-processing engine accommodates variety of work. High per...

ACCRETECH SS20

Footprint Small footprint with highly stable structure Compliant with large wafers 250 mm square work size as a standard feature * High-resolution microscope Improved resolution User Friendly Impro...

ACCRETECH SS30

Footprint Small footprint with highly stable structure Compliant with varieties of work ・300 mm wafer ・Alignment with multiple works attachment ・Deformed and elastic work alignment High-resolution ...

ACCRETECH UF3000EX

High throughput is realized by synergetic effect of XY stage with high-speed and great quietness created by the high-speed wafer handling and exclusive driving unit. Furthermore, Z axis achieved th...

ACCRETECH UF3000EX-e

High throughput is realized by synergetic effect of XY stage with high-speed and great quietness created by the high-speed wafer handling and exclusive driving unit. Furthermore, Z axis achieved th...

ACCRETECH UF3000LX

High-speed and low-vibration are realized by adopting the newly developed exclusive XY driving system. Compared with the existing products, it achieved the small footprint by design change and redu...

ACCRETECH W-GM-4200

Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-co...

ACCRETECH W-GM-5200

ACCRETECH W-GM-6200

Wafer Size Φ 450 mm Best Seller Machine W-GM-Series Improve the Space Efficiency by the Compact Design Highly Accurate Grinding by the Synchronized X, Y, θ Support Control Easy Operation by Touch P...