nViant provides a CO2-based laser microvia drilling solution with a unique combination of high-quality via formation and high-accuracy, in a robust via drilling system that delivers high-volume laser processing throughput at a competitive price point. Maintain your PCB laser processing production throughput for HDI applications without sacrificing quality or accuracy.

The nViant via drilling system precisely drills blind (BHV) and through-hole vias (LTH) in coppercladded, glass woven reinforced materials (FR-4) at a typical range of 40 to 300µm, and enables pcb laser processing customers to Include rigid HDI processing as part of a broader portfolio of services and at a lower cost of ownership, while leveraging the experience of a laser systems provider that has a demonstrated history of applied laser expertise.