FISCHERSCOPE X-RAY XDV®

型號
X-RAY XDV®
  • 產品概述

    Features

    Hands-free operation, fully automated measurement process under well-defined constant metrology conditions
    Industry-leading polycapillary optics for microspot measurement on structures as small as 10 µm
    Very high detector sensitivity and resolution provide precise results
    Automatic recognition of measurement structures and shift-compensation of measurement spot
    Easy and intuitive system software
    Service and maintenance friendly design
    Designed to work under clean room conditions
    Automated and manual measurements possible with the same instrument

    Typical fields of application
    Layer thickness and compositional analysis
    Under-bump metallization (UBM) down to the nm scale
    C4 solder bumps and smaller
    Lead-free solder caps on copper pillars
    Ultra small landing pads and other advanced 2.5D/3D packaging solutions

  • 關於公司
    Fischer Technology, Inc.

    Fischer is a manufacturer of non-destructive coating thickness measurement, material testing, nanoindentation and material analysis instrumentation including calibration and certification. Measurement methods available from Fischer include X-Ray fluorescence, beta backscatter, magnetic induction, eddy current, and coulometric measurement principles that are incorporated into hand-held and/or bench top models.


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