State-of-the-art FPC laser drilling system in a low cost-of-ownership platform.
GemStone™ is a perfect match for leading-edge flex circuit manufacturers who want to process ultra-small blind and through vias on the latest generation of flex materials. GemStone™ can lower process cost and improve product quality and yield for these applications by coupling ESI’s latest Third Dynamics™ beam positioning technology with an ESI-designed short pulse width, high pulse rate, high power fiber laser source.

GemStone’s high power, high pulse rate laser with GemPulse™ technology enables fast material ablation, while its Third Dynamics™ three-level compound beam positioning system moves the beam quickly between features. Third Dynamics™ further enables fast tooling velocities to avoid heating any one area up too much – a typical quality and yield problem with features smaller than 75 microns and laminates with copper thicknesses smaller than 12 microns. ESI’s class-leading Precision Pulse™ digital power control system further avoids yield issues for sensitive materials.

If you are looking reduce existing yield or processing costs for difficult applications or want to future-proof your flex processing line, consider Gemstone™.