With an installed base of more than thousands of systems, Perkin-Elmer was a leading supplier of sputter deposition equipment for high technology application in 1990's. The Perkin-Elmer 4400 Series, fully refurbished and upgraded by Allwin21 Corp., were designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin21's new AW-4450 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every fully refurbished and upgraded Perkin Elmer sputtering system was supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service
Perkin-Elmer 4400, 4410, 4450 Proven Sputter Materials:
Al+W ,Cr/SiO2,SiC ,Ti+Au,InSnO ,SiO2 ,Ti/W ,Ti+Au+Ni,Al2O3 ,Mo ,SiO2+O2 ,Ni/Fe+Cu+SiO2,Ag MoSi2 ,Si+N2(Si3N4) ,Ti/W+Au,Au ,Mo2Si5 ,Si+N2+B4C, Ti/W+Au+Ta, C, Mo5Si3 ,Ta ,Ti/W+Al/Si,Cr Ni ,TaC, Ti/W+Ni/Cr+Au,Cr/Co ,Ni/Cr, Ta+Au , Ti/W+Pt,Cr/Au, Ni+Ni/Cr, TaSi2 ,Al+Ti/W+Ag, Cr+Cu, Ni/Fe ,Ta+SiO2 , W+Al2O3,Cr/Si ,Pt, Zr ,Zn,Cr/SiO, TiO2 ,TiO2+Cr, ZnO2
Perkin-Elmer 4400, 4410, 4450 Sputter Key Features:
Production-proven sputter technology
Optimum AW-4450 System Control
DC 24V for Motors, Actuator, Relay, Solenoid
Efficient 8" Delta cathodes, 2 to 6" option
Full Pallet rotation control with “indexing”
High Uniformity and Yield
DC, RF Sputter, Pulse DC option
Magnetron and Diode Sputter option
RF Etch and Bias are optional
Ultra Clean vacuum system
Load lock operation
UHV design
Flexible for development or production use
Full range of substrate sizes and shapes
Various pumping and power options
Co-sputtering option
Reactive Sputtering option
Made in U.S.A.
Perkin-Elmer 4400, 4410, 4450 Sputter Software Key Features:
Maintenance, Manual, Semi Automatic and Fully Automatic modes.
Automated calibration of all subsystems.
Troubleshooting to subassembly levels.
Programmed comprehensive calibration and diagnostic functions.
Recipe creation for full automatic wafer processing.
Automatic decline of improper recipes and process data inputs.
Multi-level password protection.
Storage of multiple recipes and system functions.
Real-Time process graphics, data acquisition display, and analysis.
Process Data and Recipe storage automatically to hard drive.
Easy TC vacuum gauge calibration.
Positioning Deposition (optional)
GEM/SECS II (optional)
Perkin-Elmer 4400, 4410, 4450 Configuration:
Main Frame
28" dia. SST chamber top plate with ports for 8-inch(4) circle or Delta (3) Cathodes
Sputter Power Supply,DC or RF or Pulse DC power, RF: 1-3KW; DC: 5KW or 10KW
Process Chamber
8" diameter X 12" high stainless steel cylinder with 6"
CF flange viewport and load lock port
28" diameter stainless steel base plate
11/2" air-operated roughing isolation valve
Air-operated gas inlet valve
Air-operated vent valve
11/2"blanked-off leak check port
Removable deposition shields
23" diameter, 3-position water-cooled annular substrate table with variable-speed motorized table drive
Full circle shutter and vane shutter
Chain drive pallet carrier transport
Heavy duty electric hoist
Load lock
30" x 28" x 8" stainless steel load lock chamber with aluminum cover
Chain drive pallet carrier transport
2" air-operated roughing isolation valve
Air-operated vent valve
23" diameter molybdenum annular substrate pallet
Elevator for pallet up and down function.
Vacuum Systems for process Chamber
2 stage Cryo pump with 1000 l/s pumping speed for air, including chevron, water-cooled compressor and lines, automatic regeneration controller and plumbing kit. 71/2" O.D. (6" ASA) aluminum air-operated gate valve Air-operated venetian blind throttling valve.
36.7 cfm mechanical pump or dry pump for process chamber and load lock (Optional)
1 gas line with MFC(Ar, 200 SCCM or Customized)
New Controller: Allwin21 Corp.'s AW-4450 System PC Control
New Power Distribution Box: AC380V /208V/ 3Phase
Perkin-Elmer 4400, 4410, 4450 Sputter Options:
GEM/SECS II function (Software)
More gas lines with MFC(① N2; ② O2; ③ Customized)
Lamp tower alarm with buzzer.
Mechanical pump or dry pump for process chamber and load lock.
Independent mechanical pump or dry pump for process chamber.
Chiller for Cooling plates and table.
Turbo pump for load lock.
Load lock Lamp Heating function, Up to 200°C
Chamber Lamp Heating function, Up to 300°C (Use one cathode port in SST chamber top plate).
Plasma etch function (before sputter)
Bias function
Co-sputter function
Reactive sputter function
Transformer for AC 380V to 208V for DC Power Supply (if necessary).